News Center
DaStrong @ InterPACK 2015
DaStrong @ InterPACK 2015 July 9th 2015

The International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) by ASME is a world-class conference for packaging related technologies. Thermal management, as one of the crucial components, has always been a heated topic in this conference. This year for the first time, the InterPACK and the International Conference on Nanochannels,Microchannels and Minichannels (ICNMM) will jointly hold their conferences together in San Francisco, California, USA.

Mr.Hanyang Xu authored and publicized a paper with the title of “A miniature double-oscillating fan cooling system using electromagnetic force”. During the conference, our team have been approached by companies in the field of thermal management as well as companies with the demand of alternative cooling solutions. We look forward to discussing with them in further details and formalize more win-win partnerships.

You can access the publication here:

Track 4-10 A miniature double oscillating-fan cooling system using electromagnetic force.