Nowadays we can all see that miniaturization is the general trend for the electronics industry. From laptops to Ultrabooks, from tablets to wearable devices, smaller and faster seems to be the universal goal of consumer electronics. Electronic miniaturization is not simply a process of making everything smaller. More importantly, miniaturization brings up challenge for links in the overall design and manufacturing process. From the history of electronics development, we can observe that progress often comes in separately various components, semiconductor, PC board, power supply, packaging, and of course, thermal management.
Thermal management has been recognized as one of the main challenges in the miniaturization process - particularly as the computation power increases while the form factor decreases. The heat load are expected to grow significantly as the packaging density rises over time.
On the contrary, the dominant existing active air cooling solution, rotary fans and rotary blowers, has not improved significantly comparing to its older stages. The bearing structure remains relatively vulnerable to the internal friction force that could be affected by various environmental factors including dust accumulation, humidity, salt spray, etc. The key parameter for market adoption, just like any other products, is whether or not consumers will tolerate the cost of achieving such form factor. Admittedly the rotary air movers have made progress in the past, such as double-ball bearing structure for extended reliability. Much of such developments, however, come at the cost of either more complicated structure or reduced yield rate, both result in a higher overall cost.
Aware of this scenario, DaStrong has recently pushed its innovative vibrating cooling solution to a higher level. Under the cooperation with an multinational company, DaStrong has developed a customized ultra-thin active air mover for their stick-shaped miniPC. The latest version has a thickness of only 4 mm - less than two quarters stacked together. The latest thermal simulation test has demonstrated that the cooling capacity is sufficient for the maximum performance case and DaStrong has moved on to enabling and implementation stage for such ultra-thin active cooling solution.
Comparing to the existing ultra-thin rotary fans, DaStrong module has a lower operating noise, reduced power consumption and extended lifetime. More importantly, its simple structure allows a strong competitive advantage in cost relative to the current solutions.
In the meantime, DaStrong is also developing solutions for other portable devices such as hand held micro projectors.